功率半导体器英文翻译

Question

功率半导体器件和微电子
功率半导体器件是半导体器件中的重要一环，它和微电子器件关系紧密，因为微电子器件需要功率半导体器件配套以提供其电源及执行系统。如迅速发展的电脑，当CPU从286，486，向奔腾I，II，III，IV…发展时，对作为电源的功率半导体要求也愈来愈苛刻。例如现在正在发展电压小于1伏，电流上百安培的电源，这就必须发展最新的MOSFET器件才能满足需要。为了达到这些不断更新的性能指标，功率半导体器件必须采用微电子器件相似的精细工艺。这也是本文将详细叙述的。
功率半导体器件和集成电路的紧密结合，在图一中列了四个方面:即
1)功率和微电子器件在芯片制造工艺上已日趋接近:功率MOS型器件为了达到更好的性能，例如要求更低的通态电阻，其工艺已从二十年前的几微米的技术迅速向亚微米甚至深亚微米发展。这和微电子器件的发展是一致的。
2)MOS型器件的封装技术也正在向集成电路靠近。这几年来，功率MOS器件已采用了像倒置(Flip)，球栅阵列(BGA)和多芯片模块(MCM)等包装形式。这些都是比较新的集成电路包装形式。
3)从器件结构来看，把功率MOS型器件和集成电路做在同一个芯片上或是同一个包装中，是新的发展方向之一。所以把功率半导体器件简单地等同为分立器件就不再合适了。以IR公司产品为例，功率集成电路，或是和IC做在一起的功率器件，以及特殊的先进器件，已占有其产品的一半以上。
4)全面解决(Total Solution)是各种器件的最终设想。寻求器件的功能完整，解决应用中所有的问题是器件制造者的理想。有了集成电路进入了功率半导体器件，这种全面解决的方案就更容易实现了。不仅对小功率方向是如此，甚至大功率方向也在追求更大的集成度和全面解决方案。当然，由一个器件来包含所有功能并不一定永远是最佳方案。例如要考虑成品率的损失，还要注意保护客户主动开发电路的积极性。
注：本文为"中国集成电路"杂志而写，故着重讲了电力半导体和集成电路的关系，以求集成电路界关心功率半导体的发展。
张为佐: 从我国第一个晶闸管研究课题开始，在国内外从事功率半导体研究近四十年。近二十年来参与了大量行业及业务发展工作，现任美国IR公司总部中国经理兼高级技术顾问，西安IR半导体公司副董事长，中国电源学会常务理事兼元器件专委会主任委员，西安理工大学兼职教授。有关个人二十年来功率半导体及电力电子发展的论文集。
本文发表于"中国集成电路"2008年1月期。

Answer 1

The power semiconductor device and the micro electron
power semiconductor device is in the semiconductor device important link, it and the micro electron component relations is close, because the micro electron component required power semiconductor device forms a complete set provides its power source and the execution system.If develops rapidly computer, when CPU from 286,486, to gallops I, II, III, IV…When development, to took the power source the power semiconductor request increasingly is also harsh.For example the present is developing the voltage to be smaller than 1 volt, on the electric current hundred amperes power sources, this must develop the newest MOSFET component to be able to meet the needs.In order to achieve these renew unceasingly the performance index, the power semiconductor device must use the micro electron component similar fine craft.This will also be this article is detailed narrates.
The power semiconductor device and the integrated circuit close union, in the one has arranged in order four aspects in the chart: Namely
1) power and micro electron component in chip manufacture craft already day by day close: The power MOS component in order to achieve a better performance, for example requests to pass condition the resistance lowly, its craft already from 20 year ago several microns technologies rapidly to submicron even deep submicron development.This and the micro electron component development is consistent.
2) the MOS component seal technology is also approaching to the integrated circuit.These for years, the power MOS component has used has inverted (Flip) likely, ball grid array (BGA) and packing forms and so on multi-chip module (MCM).These all are the quite new integrated circuit packing forms.

3) looked from the component structure that, makes the power MOS component and the integrated circuit in the identical chip perhaps the identical packing, is one of recent development directions.Therefore the power semiconductor device equates simply for established separately the component no longer to be appropriate.Take the IR Corporation product as the example, the power integrated circuit, perhaps and IC does in the same place power component, as well as the special advanced component, held its product one above the half.
4) the comprehensive solution (Total Solution) is each kind of component finally conceives.Seeks the component the function integrity, in the solution application all questions is the component manufacturer's ideal.Had the integrated circuit to enter the power semiconductor device, this kind of comprehensive solution plan was easier to realize.Not only to the low power direction is so, even the high efficiency direction is also pursuing a greater integration rate and the comprehensive solution.Certainly, contains all functions by a component not necessarily forever is the preferred plan.For example must consider the rate of finished products the loss, but also must pay attention to the protection customer to develop the electric circuit on own initiative the enthusiasm.