第1个回答 2022-11-15
SMT常见电子元件分类,功能及封装形式\x0d\x0a以下数据仅供参考,如有出入以实际为主\x0d\x0a主动组件-TR,IC,DIODE\x0d\x0a被动组件-R,C,L\x0d\x0a半导体-TR(双极性),IC,DIODE(二极管)\x0d\x0a电子组件分类:\x0d\x0a1.电阻R-\x0d\x0a阻止电流流通,产生压降零件\x0d\x0a2.电容C-\x0d\x0a有储存电荷之零件\x0d\x0a3.电感L-\x0d\x0a电感在于控制磁场及转变磁场变化,亦可储存能量\x0d\x0a3.晶体管TR-\x0d\x0a由两块NP型半导体即为TR,主要用于放大及衰减(讯号,电流,电压等)\x0d\x0a4.二极管D-\x0d\x0a将N型及P型半导体对半相接,即为二极管,用于稳压及整流\x0d\x0a5.集成电路IC-\x0d\x0a为一完整电子回路之芯片,内含R.C.L.TR等组件\x0d\x0a各组件种类,功能\x0d\x0a1.R~\x0d\x0a陶瓷,单芯片,热敏,光敏,VR\x0d\x0aDIP电阻(碳素皮膜电阻,碳素混合体电阻,金属皮膜电阻)\x0d\x0a水泥电阻(线绕,陶瓷,水泥)\x0d\x0a2.C~\x0d\x0a电解电容ec-铝质~滤掉低频-钽质~泸掉中,低频\x0d\x0a陶瓷电容cc-泸掉高频\x0d\x0a薄膜电容~金属\x0d\x0a云母电容~泸掉中频\x0d\x0a3.L~\x0d\x0a硅钢片\x0d\x0a铁粉心\x0d\x0a4.TR~\x0d\x0aC(接地)pnp~使讯号持续\x0d\x0aE(接地)npn~放大讯号\x0d\x0aC集极\x0d\x0aB基极\x0d\x0aE射极\x0d\x0a5.DIODE~\x0d\x0a6.IC~\x0d\x0aRC电路~反向器\x0d\x0a单晶电路~执行function功能\x0d\x0a单晶+RC~控制function讯号\x0d\x0a单晶+L~混波用以放大及衰减\x0d\x0aPower放大电路~稳压及回授讯号\x0d\x0a单晶+RCL~放大\x0d\x0a7.振荡器\x0d\x0a组件启动所须之频率\x0d\x0a8.Connector\x0d\x0a连接两组件,回路?\x0d\x0a封装型式\x0d\x0a1.SOT(ShrinkOutlineTransistor)~TRorDIO三脚以上,脚位分在两侧,常以塑料封装,塑料带\x0d\x0a2.PLCC(PlasticLeadedChipCamier)~\x0d\x0a四边J型脚,塑料主体,脚数20-84,可为正方形or矩形,主体宽由0.35”-1.15”,主用于减小机板空间(pitch1.27mm)\x0d\x0a3.TSSOP(ThinSmallShrinkOutlinePackage)~\x0d\x0a增加热效应,增加散热150%,\x0d\x0a脚数8-80,主体3mm,4mm,6.1Mm(宽),厚0.9MM(4.4;6.1)厚0.85(3)\x0d\x0apitch~0.4mm~0.65mm\x0d\x0a4.SSOP(SmallShrinkOutlinePackage)~\x0d\x0a脚数8-64主体209~300mils(5.3mm~10.2mm),\x0d\x0apitch0.65mm~1.27mm\x0d\x0a脚宽(0.2m~0.34mm),增加散热110%\x0d\x0a5.SOP(ShrinkOutlinePackage)~\x0d\x0aPitch1.27mm\x0d\x0a6.SOJ~J型脚\x0d\x0a脚宽(0.33mm~0.51mm)\x0d\x0a7.TSOP(ThinSmallOutlinePackage)~\x0d\x0a比较薄,厚度1.0mm,pitch0.5mm~1.27mm\x0d\x0a8.CQFP(CeramicQuadFlatPack)~\x0d\x0a陶瓷材质,脚数14~304,pitch15.7mils~50,盖子接缝于400度~460度处理\x0d\x0a9.LCC(LeadlessCeramicCrrier)~\x0d\x0a陶瓷材质,以pad取代lead,picth1.0mm~1.27mm脚数16~84\x0d\x0a10.BQFP(BumperedQuadFlatPack)~\x0d\x0a在四周有缓冲槽杆,pitch0.636mm(25mil)\x0d\x0a11.QFP(PlasticQuadFlatPack)~\x0d\x0aPitch0.4mm~1mm厚2mm以上\x0d\x0a12.LQFP(LowProfileQuadFlatPack)~\x0d\x0a比较薄1.4mmfootprint2.0mm脚数32~256\x0d\x0abodysize5x5m~28x28mmpitch0.3mm~0.65mm\x0d\x0a13.FC(FlipChip)\x0d\x0a14.FCCSP(FlipChipCSP)~\x0d\x0a将fc以CSP方式处理\x0d\x0a15.CBGA(CeramicBallGridArray)~\x0d\x0a以陶瓷为基底,环气胶or金属盖,接缝封胶,锡球90Pb/10Sn\x0d\x0a本体15mm-32.5mm,pitch1.27mm\x0d\x0a16.PBGA(PlasticBallGridArray)~\x0d\x0a改善热效应,增大SMT可靠度,pitch1.0mm以上,球63/37SnPb\x0d\x0a1.0mm<=>球径0.5mm;0.63mm;1.27mm-->球径0.76mm\x0d\x0a1.5mm-->球径0.76mm,本体13mm~45mm\x0d\x0a17.CSP(ChipScalePackage)\x0d\x0a球径0.3mmpitch0.5mm\x0d\x0a18.MLF(MicroLeadFrame)\x0d\x0a19.µBGA\x0d\x0aPitch0.5-0.8球径0.3